Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications

Aftab M Hussain; Muhammad M Hussain

doi:10.1002/smll.201600952

Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications

Small. 2016 Oct;12(37):5141-5145. doi: 10.1002/smll.201600952. Epub 2016 Jul 25.

Authors

Aftab M Hussain¹, Muhammad M Hussain²

Affiliations

¹ Integrated Nanotechnology Laboratory and Integrated Disruptive Electronic Applications Laboratory (IDEA) Laboratory, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955, Saudi Arabia.
² Integrated Nanotechnology Laboratory and Integrated Disruptive Electronic Applications Laboratory (IDEA) Laboratory, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955, Saudi Arabia. muhammadmustafa.hussain@kaust.edu.sa.

PMID: 27453536
DOI: 10.1002/smll.201600952

Abstract

A design strategy for fully flexible electrode arrays with out-of-plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz (Z ≈ 20 Ω, θ ≈ 0°).

Keywords: 3D integration; flexible electronics; sensors; through polymer vias.