Grinding damage assessment on four high-strength ceramics

Abstract

Objectives: The purpose of this study was to assess surface and subsurface damage on 4 CAD-CAM high-strength ceramics after grinding with diamond disks of 75 μm, 54 μm and 18 μm and to estimate strength losses based on damage crack sizes.

Methods: The materials tested were: 3Y-TZP (Lava), dense Al2O3 (In-Ceram AL), alumina glass-infiltrated (In-Ceram ALUMINA) and alumina-zirconia glass-infiltrated (In-Ceram ZIRCONIA). Rectangular specimens with 2 mirror polished orthogonal sides were bonded pairwise together prior to degrading the top polished surface with diamond disks of either 75 μm, 54 μm or 18 μm. The induced chip damage was evaluated on the bonded interface using SEM for chip depth measurements. Fracture mechanics were used to estimate fracture stresses based on average and maximum chip depths considering these as critical flaws subjected to tension and to calculate possible losses in strength compared to manufacturer's data.

Results: 3Y-TZP was hardly affected by grinding chip damage viewed on the bonded interface. Average chip depths were of 12.7±5.2 μm when grinding with 75 μm diamond inducing an estimated loss of 12% in strength compared to manufacturer's reported flexural strength values of 1100 MPa. Dense alumina showed elongated chip cracks and was suffering damage of an average chip depth of 48.2±16.3 μm after 75 μm grinding, representing an estimated loss in strength of 49%. Grinding with 54 μm was creating chips of 32.2±9.1 μm in average, representing a loss in strength of 23%. Alumina glass-infiltrated ceramic was exposed to chipping after 75 μm (mean chip size=62.4±19.3 μm) and 54 μm grinding (mean chip size=42.8±16.6 μm), with respectively 38% and 25% estimated loss in strength. Alumina-zirconia glass-infiltrated ceramic was mainly affected by 75 μm grinding damage with a chip average size of 56.8±15.1 μm, representing an estimated loss in strength of 34%. All four ceramics were not exposed to critical chipping at 18 μm diamond grinding.

Conclusions: Reshaping a ceramic framework post sintering should be avoided with final diamond grits of 75 μm as a general rule. For alumina and the glass-infiltrated alumina, using a 54 μm diamond still induces chip damage which may affect strength. Removal of such damage from a reshaped framework is mandatory by using sequentially finer diamonds prior to the application of veneering ceramics especially in critical areas such as margins, connectors and inner surfaces.

Keywords: Ceramics; Damage; Fractography; Fracture mechanics; Grinding.