The continued miniaturization of electronic components demands integrated liquid cooling systems with minimized external connections and fabrication costs that can be implanted very close to localized hot spots. This might be challenging for existing liquid cooling systems because most of them rely on external pumps, connecting tubes, and microfabricated heat sinks. Here, we demonstrate an integrated liquid cooling system by utilizing a small droplet of liquid metal Galinstan, which is placed over the hot spot. Energizing the liquid metal droplet with a square wave signal creates a surface tension gradient across the droplet, which induces Marangoni flow over the surface of droplet. This produces a high flow rate of coolant medium through the cooling channel, enabling a "soft" pump. At the same time, the high thermal conductivity of liquid metal extends the heat transfer surface and facilitates the dissipation of heat, enabling a "soft" heat sink. This facilitates the rapid cooling of localized hot spots, as demonstrated in our experiments. Our technology facilitates customized liquid cooling systems with simple fabrication and assembling processes, with no moving parts that can achieve high flow rates with low power consumption.
Keywords: Galinstan; Marangoni effect; convective cooling; electrowetting; heat sink; integrated cooling system; liquid metal.