In the welding process between similar or dissimilar materials, inserting an intermediate layer and pressure assistance are usually thought to be necessary. In this paper, the direct welding between alumina-silicate glass and metal (aluminum, copper, and steel), under exposure from 1 kHz femtosecond laser pulses without any auxiliary processes, is demonstrated. The micron/nanometer-sized metal particles induced by laser ablation were considered to act as the adhesive in the welding process. The welding parameters were optimized by varying the pulse energy and the translation velocity of the sample. The shear joining strength characterized by a shear force testing equipment was as high as 2.34 MPa. This direct bonding technology has potential for applications in medical devices, sensors, and photovoltaic devices.