We report a detailed advanced materials characterization study on 40 nm thick strained germanium (Ge) layers integrated on 300 mm Si(001) wafers via strain-relaxed silicon-germanium (SiGe) buffer layers. Fast-scanning X-ray microscopy is used to directly image structural inhomogeneities, lattice tilt, thickness, and strain of a functional Ge layer down to the sub-micrometer scale with a real space step size of 750 μm. The structural study shows that the metastable Ge layer, pseudomorphically grown on Si(0.3)Ge(0.7), exhibits an average compressive biaxial strain of -1.27%. By applying a scan area of 100 × 100 μm(2), we observe microfluctuations of strain, lattice tilt, and thickness of ca. ±0.03%, ±0.05°, and ±0.8 nm, respectively. This study confirms the high materials homogeneity of the compressively strained Ge layer realized by the step-graded SiGe buffer approach on 300 mm Si wafers. This presents thus a promising materials science approach for advanced sub-10 nm complementary metal oxide-semiconductor applications based on strain-engineered Ge transistors to outperform current Si channel technologies.
Keywords: CMOS; Ge layer; nanodiffraction; strain; structural mapping.