An advanced, ultra-thin, flexible LED (FLED) package technique is first proposed in this study, where a polyimide substrate was used as the lead frame package material due to its physical stability in thermal processing. The experimental results showed that the thickness of the mockup sample measured by a vernier caliper was 260 μm and 35% thinner than the Panasonic organic LED lighting panel announced on 4 March 2014 in Tokyo. Moreover, the flexible angle of the ultra-thin LED package was 200.54° when it surrounded a disk with a 1 cm radius. A design of a micro-lens array manufactured by silicone molding on the FLED is also proposed in this study. Finally, different types of micro-lenses were applied to different lighting regions to investigate their lighting effects.