In polymer-based electric microdevices, thermal transport across polymer/ceramic interface is essential for heat dissipation, which limits the improvement of the device performance and lifetime. In this work, four sets of polystyrene (PS) thin films/sapphire samples were prepared with different interface adhesion values, which was achieved by changing the rotation speeds in the spin-coating process. The interfacial thermal conductance (ITC) between the PS films and the sapphire were measured by time domain thermoreflectance method, and the interfacial adhesion between the PS films and the sapphire, as measured by a scratch tester, was found to increase with the rotation speed from 2000 to 8000 rpm. The ITC shows a similar dependence on the rotation speed, increasing up to a 3-fold from 7.0 ± 1.4 to 21.0 ± 4.2 MW/(m(2) K). This study demonstrates the role of spin-coating rotation speed in thermal transport across the polymer/ceramic interfaces, evoking a much simpler mechanical method for tuning this type of ITC. The findings of enhancement of the ITC of polymer/ceramic interface can shed some light on the thermal management and reliability of macro- and microelectronics, where polymeric and hybrid organic-inorganic nano films are employed.
Keywords: interfacial adhesion; interfacial thermal conductance; polymer thin film; spin-coating; time domain thermoreflectance.