Low Temperature Sintering Cu6 Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Ying Zhong; Rong An; Chunqing Wang; Zhen Zheng; Zhi-Quan Liu; Chin-Hung Liu; Cai-Fu Li; Tae Kyoung Kim; Sungho Jin

doi:10.1002/smll.201500896

Low Temperature Sintering Cu6 Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Small. 2015 Sep 2;11(33):4097-103. doi: 10.1002/smll.201500896. Epub 2015 Jun 1.

Authors

Ying Zhong^{1

2}, Rong An^{1

3}, Chunqing Wang^{1

3}, Zhen Zheng¹, Zhi-Quan Liu⁴, Chin-Hung Liu², Cai-Fu Li⁴, Tae Kyoung Kim², Sungho Jin²

Affiliations

¹ State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China.
² Materials Science and Engineering, University of California at San Diego, 9500 Gilman Dr., La Jolla, CA, 92093, USA.
³ Key Laboratory of Microsystems and Microstructures Manufacturing, Ministry of Education, Harbin Institute of Technology, Harbin, 150080, China.
⁴ Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China.

PMID: 26034023
DOI: 10.1002/smll.201500896

Abstract

Brittle intermetallics such as Cu6 Sn5 can be transformed into low cost, nonbrittle, superplastic and high temperature-resistant interconnection materials by sintering at temperatures more than 200 °C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore-free with nanograins, and the interface is super-uniform.

Keywords: TEM; high temperature interconnection; intermetallics; nanoparticles; sintering.