Design and fabrication of novel stretchable device arrays on a deformable polymer substrate with embedded liquid-metal interconnections

Abstract

Stretchable devices are fabricated on a newly designed deformable substrate. Active devices attached on the stiff islands are electrically connected by an embedded EGaIn interconnection, which ensures protection from external damage. In this structure, the local strain in the active device area is estimated to be less than 1% under applied strain of 30% by analysis of the strain distribution using the finite element method.

Keywords: deformable substrates; double integration; embedded interconnections; stretchable device arrays.