Prevention of Staphylococcus epidermidis biofilm formation using electrical current

J Appl Biomater Funct Mater. 2014 Sep 5;12(2):81-3. doi: 10.5301/jabfm.5000208.

Abstract

A technique for the prevention of staphylococcal adhesion by electrical current exposure was investigated. Teflon coupons were exposed to a continuous flow of 103 cfu/ml Staphylococcus epidermidis with or without 2000 microA DC electrical current delivered by electrodes on opposite sides of a coupon, touching neither each other nor the coupon. A mean 3.46 (SD, 0.20) and 5.70 (SD, 1.03) log10 cfu/cm2 were adhered to the non-electrical current exposed coupons after 4 h and 24 h, respectively. A mean 2.46 (SD, 0.31) and 1.47 (SD, 0.73) log10 cfu/cm2 were adhered after 4 h and 24 h with exposure to 2000 microA electrical current delivered by graphite electrodes. A mean 2.21 (SD, 0.14) and 0.55 (SD, 0.00) log10 cfu/cm2 were adhered after 4 h and 24 h with exposure to 2000 microA electrical current delivered by stainless steel electrodes. Electrical current may be useful in the prevention of staphylococcal adhesion to biomaterials.

Publication types

  • Research Support, N.I.H., Extramural

MeSH terms

  • Bacterial Adhesion
  • Biofilms / growth & development*
  • Electricity*
  • Electrodes
  • Graphite / chemistry
  • Stainless Steel / chemistry
  • Staphylococcus epidermidis / physiology*

Substances

  • Stainless Steel
  • Graphite