Polystyrene films as barrier layers for corrosion protection of copper and copper alloys

Loránd Románszki; Iaryna Datsenko; Zoltán May; Judit Telegdi; Lajos Nyikos; Wolfgang Sand

doi:10.1016/j.bioelechem.2013.10.002

Polystyrene films as barrier layers for corrosion protection of copper and copper alloys

Bioelectrochemistry. 2014 Jun:97:7-14. doi: 10.1016/j.bioelechem.2013.10.002. Epub 2013 Oct 25.

Authors

Loránd Románszki¹, Iaryna Datsenko², Zoltán May³, Judit Telegdi⁴, Lajos Nyikos⁵, Wolfgang Sand⁶

Affiliations

¹ Department of Interfaces and Surface Modification, Institute of Materials and Environmental Chemistry, Research Centre for Natural Sciences, Hungarian Academy of Sciences, Pusztaszeri út 59-67., 1025 Budapest, Hungary. Electronic address: romanszki.lorand@ttk.mta.hu.
² Aquatic Biotechnology, Biofilm Centre, Faculty of Chemistry, University of Duisburg-Essen, Universitätsstr. 5, 45141 Essen, Germany. Electronic address: yaryna.datsenko@gmail.com.
³ Department of Functional and Structural Materials, Institute of Materials and Environmental Chemistry, Research Centre for Natural Sciences, Hungarian Academy of Sciences, Pusztaszeri út 59-67., 1025 Budapest, Hungary. Electronic address: may.zoltan@ttk.mta.hu.
⁴ Department of Interfaces and Surface Modification, Institute of Materials and Environmental Chemistry, Research Centre for Natural Sciences, Hungarian Academy of Sciences, Pusztaszeri út 59-67., 1025 Budapest, Hungary; Institute of Media Technology and Light Industry, Faculty of Light Industry and Environmental Engineering, Óbuda University, Doberdó u. 6., 1034 Budapest, Hungary. Electronic address: telegdi.judit@ttk.mta.hu.
⁵ Department of Interfaces and Surface Modification, Institute of Materials and Environmental Chemistry, Research Centre for Natural Sciences, Hungarian Academy of Sciences, Pusztaszeri út 59-67., 1025 Budapest, Hungary. Electronic address: nyikos.lajos@ttk.mta.hu.
⁶ Aquatic Biotechnology, Biofilm Centre, Faculty of Chemistry, University of Duisburg-Essen, Universitätsstr. 5, 45141 Essen, Germany. Electronic address: wolfgang.sand@uni-due.de.

PMID: 24239277
DOI: 10.1016/j.bioelechem.2013.10.002

Abstract

Dip-coated polystyrene layers of sub-micrometre thickness (85-500nm) have been applied on copper and copper alloys (aluminium brass, copper-nickel 70/30), as well as on stainless steel 304, and produced an effective barrier against corrosion and adhesion of corrosion-relevant microorganisms. According to the dynamic wettability measurements, the coatings exhibited high advancing (103°), receding (79°) and equilibrium (87°) contact angles, low contact angle hysteresis (6°) and surface free energy (31mJ/m(2)). The corrosion rate of copper-nickel 70/30 alloy samples in 3.5% NaCl was as low as 3.2μm/a (44% of that of the uncoated samples), and in artificial seawater was only 0.9μm/a (29% of that of the uncoated samples). Cell adhesion was studied by fluorescence microscopy, using monoculture of Desulfovibrio alaskensis. The coatings not only decreased the corrosion rate but also markedly reduced the number of bacterial cells adhered to the coated surfaces. The PS coating on copper gave the best result, 2×10(3)cells/cm(2) (1% of that of the uncoated control).

Keywords: Aluminium brass; Copper–nickel; Desulfovibrio alaskensis; Microbial corrosion; Nanolayer.

Publication types

Research Support, Non-U.S. Gov't

MeSH terms

Alloys / chemistry*
Aluminum / chemistry
Bacterial Adhesion
Copper / chemistry*
Corrosion*
Desulfovibrio / physiology*
Manufactured Materials / analysis
Manufactured Materials / microbiology*
Nickel / chemistry*
Polystyrenes / chemistry*
Stainless Steel / chemistry
Surface Properties

Substances

Alloys
Polystyrenes
nickel copper alloy
Stainless Steel
Copper
Nickel
Aluminum