Cu nanoparticle-colloid was prepared by using electrical wire explosion process in liquid and it showed good dispersion stability without any kinds of additives. Mixed Cu nano-colloid was prepared with Cu nanoparticle-colloid, Copper (II) nitrate trihydrate, and polyvinyl pyrrolidone. Cu atoms are supplied from the dissociation reaction between Copper (II) nitrate trihydrate and polyvinyl pyrrolidone and fill up the gaps between Cu nanoparticles during the thermal sintering. Conductive (45 microOmega cm) Cu film was prepared at the sintering temperature of 200 degrees C by the enhancement of the formation of sintering necks.