Reliable metal deposition into TiO(2) nanotubes for leakage-free interdigitated electrode structures and use as a memristive electrode

Abstract

Nearly 100 % filling of TiO2 nanotubes with metals, including Ag, Cu, Au, and Pt, was achieved by defect-sealing treatment at the bottom of the nanotubes, followed by metal deposition using nuclei formation/coalescence. The resulting short-circuit-free interdigitated electrode configurations can, for example, be used to fabricate memristive electrodes.

Keywords: TiO2 nanotubes; electrodeposition; electrodes; sealing layer; semiconductors.