Although avalanche amorphous selenium (a-Se) is a very promising photoconductor for a variety of imaging applications, it is currently restricted to applications with electron beam readout in vacuum pick-up tube called a High-gain Avalanche Rushing Photoconductor (HARP). The electron beam readout is compatible with high definition television (HDTV) applications, but for use in solid-state medical imaging devices it should be replaced by an electronic readout with a two-dimensional array of metal pixel electrodes. However, due to the high electric field required for avalanche multiplication, it is a technological challenge to avoid possible dielectric breakdown at the edges, where electric field experiences local enhancement. It has been shown recently that this problem can be overcome by the use of a Resistive Interface Layer (RIL) deposited between a-Se and the metal electrode, however, at that time, at a sacrifice in transport properties.Here we show that optimization of RIL deposition technique allows for electroded avalanche a-Se with transport properties and time performance previously not achievable with any other a-Se structures. We have demonstrated this by detailed analysis of transport properties performed by Time-of-Flight (TOF) technique. Our results showed that a stable gain of 200 is reached at 104 V/μm for a 15-μm thick a-Se layer, which is the maximum theoretical gain for this thickness. We conclude that RIL is an enabling technology for practical implementation of solid-state avalanche a-Se image sensors.