In this paper, one-step air plasma treatment is successfully used for poly(dimethylsiloxane)(PDMS)-plastic chip bonding. The technique is green, cheap, and requires no other reagent other than air. Hydrocarbon plastics: polystyrene (PS), cyclic olefin copolymer (COC), and polypropylene (PP) have all been successfully bonded to PDMS irreversibly. The corresponding compressed air resistances are measured to be around 500 kPa for PDMS-PS, PDMS-COC, and PDMS-PP hybrid chips. The bondings are also of good quality even after storage under different temperatures and subject to solutions from acid to base.