Self-assembly-induced formation of high-density silicon oxide memristor nanostructures on graphene and metal electrodes

Nano Lett. 2012 Mar 14;12(3):1235-40. doi: 10.1021/nl203597d. Epub 2012 Feb 10.

Abstract

We report the direct formation of ordered memristor nanostructures on metal and graphene electrodes by a block copolymer self-assembly process. Optimized surface functionalization provides stacking structures of Si-containing block copolymer thin films to generate uniform memristor device structures. Both the silicon oxide film and nanodot memristors, which were formed by the plasma oxidation of the self-assembled block copolymer thin films, presented unipolar switching behaviors with appropriate set and reset voltages for resistive memory applications. This approach offers a very convenient pathway to fabricate ultrahigh-density resistive memory devices without relying on high-cost lithography and pattern-transfer processes.

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Crystallization / methods*
  • Electric Impedance
  • Electronics / instrumentation*
  • Equipment Design
  • Equipment Failure Analysis
  • Graphite / chemistry*
  • Macromolecular Substances / chemistry
  • Materials Testing
  • Metals / chemistry*
  • Microelectrodes*
  • Molecular Conformation
  • Nanostructures / chemistry*
  • Nanostructures / ultrastructure
  • Particle Size
  • Silicon Dioxide / chemistry*
  • Surface Properties

Substances

  • Macromolecular Substances
  • Metals
  • Silicon Dioxide
  • Graphite