Objective: To evaluate the effect of etching with H2O2 on the bond strength between epoxy-based glass fiber posts and resin cement.
Methods: Sixteen epoxy-based glass fiber posts were randomly divided into 4 groups (4 posts in each group) for different surface treatments. Group 1, no surface treatment (Control group); Group 2, treated with silane coupling agent for 60 s; Group 3, immersed in 10% H2O2 for 10 min then treated with silane coupling agent for 60 s; Group 4, immersed in 30% H2O2 for 10 min then treated with silane coupling agent for 60 s. Resin cement was used for the post cementation to form resin slabs which were then sectioned and trimmed into dumbbell shape to obtain microtensile specimens. Microtensile bond strengths were tested and the failure modes were examined with a stereomicroscope. Statistical analysis of microtensile bond strengths was performed with Kruskal-Wallis test.
Results: The microtensile bond strengths (standard deviation) were 18.81 (4.04) MPa for Group 1, 26.70 (9.63) MPa for Group 2, 39.07 (6.47) MPa for Group 3, 46.05 (5.97) MPa for Group 4.
Conclusion: Etching with H2O2 followed by silanization could significantly improve the bond strength between epoxy-based glass fiber posts and resin cement.