High-performance PMN-PT thick films

IEEE Trans Ultrason Ferroelectr Freq Control. 2010 Oct;57(10):2205-12. doi: 10.1109/TUFFC.2010.1679.

Abstract

This article describes some of our work on ₀.₆₅Pb(Mg₁/₃Nb(₂/₃)O₃-₀.₃₅PbTiO₃ (0.65PMN-0.35PT) thick films printed on alumina substrates. These thick films, with the nominal composition ₀.₆₅Pb(Mg₁/₃Nb(₂/₃)O₃-₀.₃₅PbTiO₃, were produced by screen-printing and firing a paste prepared from an organic vehicle and pre-reacted fine particles of avery chemically homogeneous powder. To improve the adhesion of the 0.65PMN-0.35PT to the platinized alumina substrate,a Pb(Zr₀.₅₃Ti₀.₄₇)O₃ layer was deposited between the electrode and the substrate. The samples were then sintered at 950 °C for 2 h with various amounts of packing powder on the alumina (Al₂O₃) substrates. The sintering procedure was optimized to obtain dense 0.65PMN-0.35PT films. The films were then characterized using scanning electron microscopy as well as measurements of the dielectric and piezoelectric constants.The electrostrictive behavior of the 0.65PMN-0.35PT thick films was investigated using an atomic force microscope(AFM). Finally, substrate-free, large-displacement bending type actuators were prepared and characterized, and the normalized displacement (i.e., the displacement per unit length) of the actuators was determined to be 55 μm/cm at 3.6 kV/cm.

Publication types

  • Research Support, Non-U.S. Gov't