An alternative method for evaluating subsurface damage (SSD) in ground fused silica is presented. The method can acquire the knowledge of depth and morphology of subsurface damage at the same time. The fundamental support lent to the method is the fact that the depth of field reduces as the numerical aperture (NA)/magnification increases in optical microscopes. Large depth of field without undermining NA is preferred in most applications while the narrow range of focus depth is desired for our method. Using this method, we experimented on fused silica which was ground with bound-abrasive diamond wheels and the results show good agreement with the traditional method. The consistency indicates that the proposed method is practicable and effective in inspecting the subsurface damage in optical components.