Facile imprint and wet chemical processes were used to fabricate copper damascene patterns on polyimide substrate. Poly(amic acid) substrate with trench structures as template has been successfully prepared by imprint lithography using a poly(dimethylsiloxane) mold. The doped Ni(2+) ions into a template through ion-exchange reaction were reduced by an aqueous NaBH(4) solution, resulting in the formation of a nickel thin layer along the surface structure of the template. The resulting nickel films can act as catalyst for subsequent electrodeposition of copper. After electrodeposition, a polishing process was carried out for removing excess deposited copper films, followed by imidization of the substrate. The resulting damascene structured copper films exhibited fine and good adhesion with the polyimide substrate, and they could be utilized for good application in the fields of minute copper circuit patterns on insulating substrates.