First-principles simulations of conditions of enhanced adhesion between copper and TaN(111) surfaces using a variety of metallic glue materials

Angew Chem Int Ed Engl. 2010;49(1):148-52. doi: 10.1002/anie.200905360.
No abstract available

Publication types

  • Research Support, Non-U.S. Gov't

MeSH terms

  • Aluminum / chemistry
  • Copper / chemistry*
  • Molecular Dynamics Simulation
  • Nitrogen / chemistry*
  • Ruthenium / chemistry
  • Surface Properties
  • Tantalum / chemistry*

Substances

  • Tantalum
  • Copper
  • Ruthenium
  • Aluminum
  • Nitrogen