In situ preparation of an ultra-thin nanomask on a silicon wafer

Nanotechnology. 2009 Jan 14;20(2):025301. doi: 10.1088/0957-4484/20/2/025301. Epub 2008 Dec 9.

Abstract

Porous nanomasks have been prepared in situ on an insulating silicon wafer by anodization of an aluminum film grown on it. Ultra-thin nanomasks, around 50 nm thick, were fabricated by utilizing a stop signal, a vivid color appearing at the air-electrolyte interface, and the process involved showed excellent repeatability. Finally, 2D nanoscale p-n junction arrays were fabricated on a silicon on insulator (SOI) wafer using the ultra-thin nanomasks prepared. The experimental results are in good agreement with the simulated results on the characteristics of the anodization process involved.

Publication types

  • Research Support, Non-U.S. Gov't