We describe a simple and convenient method of controlling the profile of a blazed grating that consists of using a patterned native-oxide layer of off-cut silicon (111) wafers as the mask of anisotropic etching to maximize the smooth blaze facets of the desired blaze angle and to minimize the deficiencies of the groove apexes. With the blazed-grating profile well controlled by this technique, a 1200 g/mm blazed grating was fabricated that had a blaze angle of 5.0 degrees and smooth blaze facets of about 0.2 nm rms. It was measured to have blaze efficiency in the vacuum-ultraviolet wavelength region.