Dynamic ultrafast laser spatial tailoring for parallel micromachining of photonic devices in transparent materials

Opt Express. 2009 Mar 2;17(5):3531-42. doi: 10.1364/oe.17.003531.

Abstract

Femtosecond laser processing of bulk transparent materials can generate localized positive changes of the refractive index. Thus, by translation of the laser spot, light-guiding structures are achievable in three dimensions. Increasing the number of laser processing spots can consequently reduce the machining effort. In this paper, we report on a procedure of dynamic ultrafast laser beam spatial tailoring for parallel photoinscription of photonic functions. Multispot operation is achieved by spatially modulating the wavefront of the beam with a time-evolutive periodical binary phase mask. The parallel longitudinal writing of multiple waveguides is demonstrated in fused silica. Using this technique, light dividers in three dimensions and wavelength-division demultiplexing (WDD) devices relying on evanescent wave coupling are demonstrated.