Engineered surfaces with controlled hydrophilic/ hydrophobic character have been fabricated by tailoring the substrate topography and chemistry. In this method, the substrate to be treated was first coated by a photoresist, which was then surface-roughened using SF6 plasma etching. The resulting rough texture was then transferred to the underlying silicon surface by over-etching of the photoresist. At this point, the topographically modified surface was modified chemically by controlled deposition of a thin polymer layer using plasma processing. In this way, both the surface texture and the surface chemistry could be varied independently, producing surfaces with variable wetting character, including super-hydrophilicity and super-hydrophobicity, depending on the choice of plasma polymer deposited. Chemical characterization demonstrates a correlation between the surface chemistry and the wettability of the samples after etching. The surface elementary composition contained more C-F groups as the measured contact angle increased, indicating that the change of wettability is due to both the roughness and the surface energy of the deposited photoresist. In the case of materials deposited on the plasma-treated rough surfaces, the strengthening of the wetting character is only due to the created surface roughness, as XPS analyses showed no significant chemical difference as compared to the flat polymer.