Manipulation of micrometer-scale adhesion by tuning nanometer-scale surface features

Langmuir. 2006 Jan 31;22(3):1135-42. doi: 10.1021/la0515221.

Abstract

This article demonstrates how the adhesion rates of micrometer-scale particles on a planar surface can be manipulated by nanometer-scale features on the latter. Here, approximately 500-nm-diameter spherical silica particles carrying a substantial and relatively uniform negative charge experienced competing attractions and repulsions as they approached and attempted to adhere to a negative planar silica surface carrying flat 11-nm-diameter patches of concentrated positive charge. The average spacing of these patches profoundly influenced the particle adhesion. For dense positive patch spacing on the planar collector, the particle adhesion was rapid, and the fundamental adhesion kinetics were masked by particle transport to the interface. For patch densities corresponding to a planar surface with net zero charge, particle adhesion was still rapid. Adhesion kinetics were observably reduced for patch spacings exceeding 20 nm and become slower with increased patch spacing. Ultimately, above a critical or threshold average patch spacing of 32 nm, no particle adhesion occurred. The presence of the threshold average patch spacing suggests that more than one positive surface patch was needed for particle capture under the particular conditions of this study. Furthermore, at the threshold, the length scales of the patch spacing and of the interactive surface area between the particle and the surface become similar: The concept of adhesion dominated by the matching of length scales is reminiscent of pattern recognition, even though the patch distribution on the collector is random in this work. Indeed, fluctuations play a critical role in these adhesion dynamics, hence the current behavior cannot be predicted by a mean field approach.

Publication types

  • Research Support, U.S. Gov't, Non-P.H.S.

MeSH terms

  • Nanotechnology*
  • Static Electricity
  • Surface Properties*