In this paper, we report in detail the studies of a different self-organized copper electrodeposition carried out in an ultrathin layer of CuSO4 electrolyte. On a macroscopic scale, the morphology of the electrodeposit is fingerlike. Microscopically, each fingering branch consists of long, straight copper filaments with periodic corrugated nanostructures. Branching rate of the electrodeposit is significantly decreased, compared with the patterns grown in conventional systems. Detailed information of the growth environment in the ultrathin electrodeposition system is provided, the formation mechanism of the periodic nanostructures on the deposit filaments is explored, and the origin of the significant descent of branching rate of the electrodeposit is discussed.