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wang chiun chuang
(2 results)?
Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging.
Materials (Basel). 2023 Apr 30;16(9):3482. doi: 10.3390/ma16093482.
Materials (Basel). 2023.
PMID: 37176364
Free PMC article.
Study on the Strip Warpage Issues Encountered in the Flip-Chip Process.
Chuang WC, Chen WL.
Chuang WC, et al.
Materials (Basel). 2022 Jan 3;15(1):323. doi: 10.3390/ma15010323.
Materials (Basel). 2022.
PMID: 35009468
Free PMC article.
Item in Clipboard
Strengthening of back muscles using a module of flexible strain sensors.
Chuang WC, Lin HT, Chen WL.
Chuang WC, et al.
Sensors (Basel). 2015 Feb 9;15(2):3975-87. doi: 10.3390/s150203975.
Sensors (Basel). 2015.
PMID: 25671513
Free PMC article.
Item in Clipboard
CMOS-MEMS test-key for extracting wafer-level mechanical properties.
Chuang WC, Hu YC, Chang PZ.
Chuang WC, et al.
Sensors (Basel). 2012 Dec 12;12(12):17094-111. doi: 10.3390/s121217094.
Sensors (Basel). 2012.
PMID: 23235449
Free PMC article.
Item in Clipboard
Review on the modeling of electrostatic MEMS.
Chuang WC, Lee HL, Chang PZ, Hu YC.
Chuang WC, et al.
Sensors (Basel). 2010;10(6):6149-71. doi: 10.3390/s100606149. Epub 2010 Jun 21.
Sensors (Basel). 2010.
PMID: 22219707
Free PMC article.
Review.
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