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Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads.
Materials (Basel). 2019 Nov 1;12(21):3599. doi: 10.3390/ma12213599.
Materials (Basel). 2019.
PMID: 31683914
Free PMC article.
Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS.
Wang B, Baeuscher M, Hu X, Woehrmann M, Becker K, Juergensen N, Hubl M, Mackowiak P, Schneider-Ramelow M, Lang KD, Ngo HD.
Wang B, et al. Among authors: schneider ramelow m.
Micromachines (Basel). 2020 Apr 30;11(5):474. doi: 10.3390/mi11050474.
Micromachines (Basel). 2020.
PMID: 32365783
Free PMC article.
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Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors.
Wang B, Sun L, Schneider-Ramelow M, Lang KD, Ngo HD.
Wang B, et al. Among authors: schneider ramelow m.
Micromachines (Basel). 2021 Nov 21;12(11):1429. doi: 10.3390/mi12111429.
Micromachines (Basel). 2021.
PMID: 34832840
Free PMC article.
Review.
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Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application.
Hu X, Mackowiak P, Bäuscher M, Ehrmann O, Lang KD, Schneider-Ramelow M, Linke S, Ngo HD.
Hu X, et al. Among authors: schneider ramelow m.
Micromachines (Basel). 2018 May 28;9(6):266. doi: 10.3390/mi9060266.
Micromachines (Basel). 2018.
PMID: 30424199
Free PMC article.
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On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.
Roshanghias A, Dreissigacker M, Scherf C, Bretthauer C, Rauter L, Zikulnig J, Braun T, Becker KF, Rzepka S, Schneider-Ramelow M.
Roshanghias A, et al. Among authors: schneider ramelow m.
Micromachines (Basel). 2020 May 31;11(6):564. doi: 10.3390/mi11060564.
Micromachines (Basel). 2020.
PMID: 32486457
Free PMC article.
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Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration.
Braun T, Becker KF, Hoelck O, Voges S, Kahle R, Dreissigacker M, Schneider-Ramelow M.
Braun T, et al. Among authors: schneider ramelow m.
Micromachines (Basel). 2019 May 23;10(5):342. doi: 10.3390/mi10050342.
Micromachines (Basel). 2019.
PMID: 31126083
Free PMC article.
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Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration.
Lykova M, Panchenko I, Schneider-Ramelow M, Suga T, Mu F, Buschbeck R.
Lykova M, et al. Among authors: schneider ramelow m.
Micromachines (Basel). 2023 Jun 30;14(7):1365. doi: 10.3390/mi14071365.
Micromachines (Basel). 2023.
PMID: 37512675
Free PMC article.
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