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Simulation of the ductile machining mode of silicon.
Int J Adv Manuf Technol. 2021;115(5-6):1565-1578. doi: 10.1007/s00170-021-07167-3. Epub 2021 May 14.
Int J Adv Manuf Technol. 2021.
PMID: 34776579
Free PMC article.
Experimental investigation of the machining characteristics in diamond wire sawing of unidirectional CFRP.
Seeholzer L, Süssmaier S, Kneubühler F, Wegener K.
Seeholzer L, et al. Among authors: sussmaier s.
Int J Adv Manuf Technol. 2021;117(7-8):2197-2212. doi: 10.1007/s00170-021-07146-8. Epub 2021 Jun 9.
Int J Adv Manuf Technol. 2021.
PMID: 34759439
Free PMC article.
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Grain flash temperatures in diamond wire sawing of silicon.
Pala U, Süssmaier S, Wegener K.
Pala U, et al. Among authors: sussmaier s.
Int J Adv Manuf Technol. 2021;117(7-8):2227-2236. doi: 10.1007/s00170-021-07298-7. Epub 2021 Jun 11.
Int J Adv Manuf Technol. 2021.
PMID: 34759440
Free PMC article.
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