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Suitability of Paper-Based Substrates for Printed Electronics.
Materials (Basel). 2022 Jan 26;15(3):957. doi: 10.3390/ma15030957.
Materials (Basel). 2022.
PMID: 35160899
Free PMC article.
Potential of Commercial Wood-Based Materials as PCB Substrate.
Immonen K, Lyytikäinen J, Keränen J, Eiroma K, Suhonen M, Vikman M, Leminen V, Välimäki M, Hakola L.
Immonen K, et al. Among authors: leminen v.
Materials (Basel). 2022 Apr 5;15(7):2679. doi: 10.3390/ma15072679.
Materials (Basel). 2022.
PMID: 35408011
Free PMC article.
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Thermoformability study of wood flour-HDPE composites with variations in wood content under vacuum forming.
Afshariantorghabeh S, Kärki T, Leminen V.
Afshariantorghabeh S, et al. Among authors: leminen v.
Heliyon. 2023 Nov 10;9(11):e22174. doi: 10.1016/j.heliyon.2023.e22174. eCollection 2023 Nov.
Heliyon. 2023.
PMID: 38045206
Free PMC article.
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Consequential life-cycle assessment of treatment options for repulping reject from liquid packaging board waste treatment.
Khan MMH, Havukainen J, Niini A, Leminen V, Horttanainen M.
Khan MMH, et al. Among authors: leminen v.
Waste Manag. 2023 Jan 1;155:348-356. doi: 10.1016/j.wasman.2022.10.026. Epub 2022 Nov 21.
Waste Manag. 2023.
PMID: 36423405
Free article.
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