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Al-Moubaraki AH, Chaouiki A, Alahmari JM, Al-Hammadi WA, Noor EA, Al-Ghamdi AA, Ko YG.Al-Moubaraki AH, et al. Among authors: ko yg.Materials (Basel). 2022 Dec 6;15(23):8688. doi: 10.3390/ma15238688.Materials (Basel). 2022.PMID: 36500184Free PMC article.
Chaouiki A, In Han D, Ko YG.Chaouiki A, et al. Among authors: ko yg.J Colloid Interface Sci. 2022 Sep 15;622:452-468. doi: 10.1016/j.jcis.2022.04.106. Epub 2022 Apr 21.J Colloid Interface Sci. 2022.PMID: 35525147
Kang JH, Ko YG.Kang JH, et al. Among authors: ko yg.Materials (Basel). 2022 May 22;15(10):3717. doi: 10.3390/ma15103717.Materials (Basel). 2022.PMID: 35629742Free PMC article.
Fatimah S, Nashrah N, Tekin K, Ko YG.Fatimah S, et al. Among authors: ko yg.Materials (Basel). 2022 Oct 11;15(20):7055. doi: 10.3390/ma15207055.Materials (Basel). 2022.PMID: 36295137Free PMC article.
Widiantara IP, Putri RAK, Han DI, Bahanan W, Lee EH, Woo CH, Kang JH, Ryu J, Ko YG.Widiantara IP, et al. Among authors: ko yg.Materials (Basel). 2023 Mar 22;16(6):2516. doi: 10.3390/ma16062516.Materials (Basel). 2023.PMID: 36984396Free PMC article.
Cho SH, Lee YJ, Bahanan W, Oh JM, Kim DJ, Kang JH, Ryu J, Widiantara IP, Ko YG.Cho SH, et al. Among authors: ko yg.Materials (Basel). 2023 May 16;16(10):3767. doi: 10.3390/ma16103767.Materials (Basel). 2023.PMID: 37241394Free PMC article.
Bahanan W, Fatimah S, Song H, Lee EH, Kim DJ, Yang HW, Woo CH, Ryu J, Widiantara IP, Ko YG.Bahanan W, et al. Among authors: ko yg.Materials (Basel). 2023 Jul 26;16(15):5252. doi: 10.3390/ma16155252.Materials (Basel). 2023.PMID: 37569963Free PMC article.
Fatimah S, Hazmatulhaq F, Sheng Y, Suhartono T, Oh JM, Nashrah N, Kang JH, Ko YG.Fatimah S, et al. Among authors: ko yg.Materials (Basel). 2023 Aug 2;16(15):5424. doi: 10.3390/ma16155424.Materials (Basel). 2023.PMID: 37570128Free PMC article.
Chafiq M, Chaouiki A, Ko YG.Chafiq M, et al. Among authors: ko yg.Nanomicro Lett. 2023 Sep 22;15(1):213. doi: 10.1007/s40820-023-01180-9.Nanomicro Lett. 2023.PMID: 37736827Free PMC article.Review.
Chaouiki A, Chafiq M, Ko YG.Chaouiki A, et al. Among authors: ko yg.Environ Res. 2024 Apr 1;246:118112. doi: 10.1016/j.envres.2024.118112. Epub 2024 Jan 4.Environ Res. 2024.PMID: 38184060