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Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid Atmosphere.
Materials (Basel). 2023 Mar 16;16(6):2389. doi: 10.3390/ma16062389.
Materials (Basel). 2023.
PMID: 36984269
Free PMC article.
Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature.
He S, Jiang J, Shen YA, Mo L, Bi Y, Wu J, Guo C.
He S, et al.
Materials (Basel). 2024 Feb 25;17(5):1055. doi: 10.3390/ma17051055.
Materials (Basel). 2024.
PMID: 38473526
Free PMC article.
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