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Electrical Interconnection and Bonding by Nano-Locking.
Nanomaterials (Basel). 2021 Jun 17;11(6):1589. doi: 10.3390/nano11061589.
Nanomaterials (Basel). 2021.
PMID: 34204330
Free PMC article.
Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness.
Guo J, Shih YC, Sheikhi R, You JP, Shi FG.
Guo J, et al. Among authors: shih yc.
Nanomaterials (Basel). 2021 Jul 24;11(8):1901. doi: 10.3390/nano11081901.
Nanomaterials (Basel). 2021.
PMID: 34443732
Free PMC article.
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