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2019 | 2 |
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Page 1
The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints.
Materials (Basel). 2019 Mar 22;12(6):960. doi: 10.3390/ma12060960.
Materials (Basel). 2019.
PMID: 30909434
Free PMC article.
Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistance.
Kim KS, Jung KH, Park BG, Shin YE, Jung SB.
Kim KS, et al. Among authors: shin ye.
J Nanosci Nanotechnol. 2013 Nov;13(11):7620-4. doi: 10.1166/jnn.2013.7846.
J Nanosci Nanotechnol. 2013.
PMID: 24245303
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Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate.
Kang MS, Kim DS, Shin YE.
Kang MS, et al. Among authors: shin ye.
Materials (Basel). 2019 Mar 21;12(6):936. doi: 10.3390/ma12060936.
Materials (Basel). 2019.
PMID: 30901825
Free PMC article.
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