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Year | Number of Results |
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2009 | 2 |
2021 | 2 |
2023 | 1 |
2024 | 0 |
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Page 1
Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding.
Micromachines (Basel). 2023 Mar 4;14(3):601. doi: 10.3390/mi14030601.
Micromachines (Basel). 2023.
PMID: 36985008
Free PMC article.
Large-Scale Rapid Laser Sintering of Highly Stretchable Electrodes Using a Homogenized Rectangular Laser Beam.
Jin Nam H, Hun Yuk J, Eom YS, Joo J, Choi KS, Choa SH.
Jin Nam H, et al. Among authors: eom ys.
J Nanosci Nanotechnol. 2021 May 1;21(5):2959-2968. doi: 10.1166/jnn.2021.19135.
J Nanosci Nanotechnol. 2021.
PMID: 33653466
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Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining.
Choi GM, Jang KS, Choi KS, Joo J, Yun HG, Lee C, Eom YS.
Choi GM, et al. Among authors: eom ys.
Polymers (Basel). 2021 Mar 20;13(6):957. doi: 10.3390/polym13060957.
Polymers (Basel). 2021.
PMID: 33804756
Free PMC article.
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Catalytic behavior of Sn/Bi metal powder in anhydride-based epoxy curing.
Jang KS, Eom YS, Moon JT, Oh YS, Nam JD.
Jang KS, et al. Among authors: eom ys.
J Nanosci Nanotechnol. 2009 Dec;9(12):7461-6. doi: 10.1166/jnn.2009.1752.
J Nanosci Nanotechnol. 2009.
PMID: 19908809
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Fabrication of poly(3-hexylthiophene) thin films by vapor-phase polymerization for optoelectronic device applications.
Jang KS, Eom YS, Lee TW, Kim DO, Oh YS, Jung HC, Nam JD.
Jang KS, et al. Among authors: eom ys.
ACS Appl Mater Interfaces. 2009 Jul;1(7):1567-71. doi: 10.1021/am900248z.
ACS Appl Mater Interfaces. 2009.
PMID: 20355962
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