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tong ming lee
(3 results)?
Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging.
Polymers (Basel). 2022 Jul 21;14(14):2950. doi: 10.3390/polym14142950.
Polymers (Basel). 2022.
PMID: 35890726
Free PMC article.
Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials.
Lee Sanchez WA, Huang CY, Chen JX, Soong YC, Chan YN, Chiou KC, Lee TM, Cheng CC, Chiu CW.
Lee Sanchez WA, et al. Among authors: lee tm.
Polymers (Basel). 2021 Jan 1;13(1):147. doi: 10.3390/polym13010147.
Polymers (Basel). 2021.
PMID: 33401420
Free PMC article.
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First fabrication of electrowetting display by using pigment-in-oil driving pixels.
Lee PT, Chiu CW, Lee TM, Chang TY, Wu MT, Cheng WY, Kuo SW, Lin JJ.
Lee PT, et al. Among authors: lee tm.
ACS Appl Mater Interfaces. 2013 Jul 10;5(13):5914-20. doi: 10.1021/am401840b. Epub 2013 Jun 27.
ACS Appl Mater Interfaces. 2013.
PMID: 23796039
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Tailoring pigment dispersants with polyisobutylene twin-tail structures for electrowetting display application.
Lee PT, Chiu CW, Chang LY, Chou PY, Lee TM, Chang TY, Wu MT, Cheng WY, Kuo SW, Lin JJ.
Lee PT, et al. Among authors: lee tm.
ACS Appl Mater Interfaces. 2014 Aug 27;6(16):14345-52. doi: 10.1021/am503599k. Epub 2014 Jul 29.
ACS Appl Mater Interfaces. 2014.
PMID: 25046453
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