Microelectromechanical systems (MEMS)-based capacitive pressure sensors are conventionally fabricated from diaphragms made of Si, which has a high elastic modulus that limits the control of internal stress and constrains size reduction and low-pressure measurements. Ru-based thin-film metallic glass (TFMG) exhibits a low elastic modulus, and the internal stress can be controlled by heat treatment, so it may be a suitable diaphragm material for facilitating size reduction of the sensor without performance degradation. In this study, a Ru-based TFMG was used to realize a flattened diaphragm, and structural relaxation was achieved through annealing at 310 °C for 1 h in a vacuum. The diaphragm easily deformed, even under low differential pressure, when reduced in size. A diaphragm with a diameter of 1.7 mm was then applied to successfully fabricate a capacitive pressure sensor with a sensor size of 2.4 mm2. The sensor exhibited a linearity of ±3.70% full scale and a sensitivity of 0.09 fF/Pa in the differential pressure range of 0-500 Pa.
Keywords: MEMS; capacitive pressure sensor; thin film metallic glass.