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seong in shin
(5 results)?
High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces.
ACS Appl Mater Interfaces. 2019 Sep 11;11(36):33428-33434. doi: 10.1021/acsami.9b10106. Epub 2019 Aug 28.
ACS Appl Mater Interfaces. 2019.
PMID: 31408316
Patient consent to publication and data sharing in industry and NIH-funded clinical trials.
Spence O, Onwuchekwa Uba R, Shin S, Doshi P.
Spence O, et al. Among authors: shin s.
Trials. 2018 May 3;19(1):269. doi: 10.1186/s13063-018-2651-2.
Trials. 2018.
PMID: 29724236
Free PMC article.
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Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor.
Mu F, Xu Y, Shin S, Wang Y, Xu H, Shang H, Sun Y, Yue L, Tsuyuki T, Suga T, Wang W, Chen D.
Mu F, et al. Among authors: shin s.
Micromachines (Basel). 2019 Sep 23;10(10):635. doi: 10.3390/mi10100635.
Micromachines (Basel). 2019.
PMID: 31547592
Free PMC article.
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