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2020 | 1 |
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Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper-copper bonding.
Sci Rep. 2020 Dec 10;10(1):21720. doi: 10.1038/s41598-020-78396-x.
Sci Rep. 2020.
PMID: 33303825
Free PMC article.
Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers.
Jeong MS, Park SW, Kim YJ, Kim JH, Hong SK, Kim SE, Park JK.
Jeong MS, et al. Among authors: kim se.
Sci Rep. 2024 Mar 20;14(1):6665. doi: 10.1038/s41598-024-57379-2.
Sci Rep. 2024.
PMID: 38509189
Free PMC article.
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Fabrication of advanced bump layer for IC power delivery.
Oh K, Ma JS, Kim S, Kim SE.
Oh K, et al. Among authors: kim se.
J Nanosci Nanotechnol. 2013 Sep;13(9):6447-50. doi: 10.1166/jnn.2013.7626.
J Nanosci Nanotechnol. 2013.
PMID: 24205680
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