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2018 | 1 |
2021 | 1 |
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Page 1
Recent Advances on GaN-Based Micro-LEDs.
Micromachines (Basel). 2023 May 1;14(5):991. doi: 10.3390/mi14050991.
Micromachines (Basel). 2023.
PMID: 37241615
Free PMC article.
Review.
Research Progress of AlGaN-Based Deep Ultraviolet Light-Emitting Diodes.
Xu R, Kang Q, Zhang Y, Zhang X, Zhang Z.
Xu R, et al. Among authors: kang q.
Micromachines (Basel). 2023 Apr 13;14(4):844. doi: 10.3390/mi14040844.
Micromachines (Basel). 2023.
PMID: 37421078
Free PMC article.
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Room-temperature bonding of glass chips via PTFE-assisted plasma modification for nanofluidic applications.
Kang Q, Wang C, Liu K, Kitamori T.
Kang Q, et al.
Lab Chip. 2023 Jun 13;23(12):2710-2719. doi: 10.1039/d3lc00169e.
Lab Chip. 2023.
PMID: 37212235
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Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture.
Kang Q, Wang C, Zhou S, Li G, Lu T, Tian Y, He P.
Kang Q, et al.
ACS Appl Mater Interfaces. 2021 Aug 18;13(32):38866-38876. doi: 10.1021/acsami.1c09796. Epub 2021 Jul 28.
ACS Appl Mater Interfaces. 2021.
PMID: 34318673
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Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O3 activation.
Xu J, Wang C, Wang T, Wang Y, Kang Q, Liu Y, Tian Y.
Xu J, et al. Among authors: kang q.
RSC Adv. 2018 Mar 23;8(21):11528-11535. doi: 10.1039/c7ra13095c. eCollection 2018 Mar 21.
RSC Adv. 2018.
PMID: 35542819
Free PMC article.
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