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2022 | 2 |
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Page 1
Electroplated Al Press Marking for Wafer-Level Bonding.
Micromachines (Basel). 2022 Jul 30;13(8):1221. doi: 10.3390/mi13081221.
Micromachines (Basel). 2022.
PMID: 36014143
Free PMC article.
Sensitivity Enhancement of Tube-Integrated MEMS Flow Sensor Using Flexible Copper on Polyimide Substrate.
Tsukada T, Takigawa R, Hasegawa Y, Al Farisi MS, Shikida M.
Tsukada T, et al. Among authors: al farisi ms.
Micromachines (Basel). 2022 Dec 24;14(1):42. doi: 10.3390/mi14010042.
Micromachines (Basel). 2022.
PMID: 36677103
Free PMC article.
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Aluminum Patterned Electroplating from AlCl₃⁻[EMIm]Cl Ionic Liquid towards Microsystems Application.
Al Farisi MS, Hertel S, Wiemer M, Otto T.
Al Farisi MS, et al.
Micromachines (Basel). 2018 Nov 12;9(11):589. doi: 10.3390/mi9110589.
Micromachines (Basel). 2018.
PMID: 30424571
Free PMC article.
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