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Page 1
Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.
J Nanosci Nanotechnol. 2012 Apr;12(4):3655-7. doi: 10.1166/jnn.2012.5616.
J Nanosci Nanotechnol. 2012.
PMID: 22849189
Characterization of Hot Deformation Behavior of Nanosized Al₂O₃ Reinforced Al6061 Composites.
Yeon KH, Park HS, Kim MS, Yu SB, Lee JK.
Yeon KH, et al. Among authors: kim ms.
J Nanosci Nanotechnol. 2019 Jul 1;19(7):3929-3934. doi: 10.1166/jnn.2019.16144.
J Nanosci Nanotechnol. 2019.
PMID: 30764952
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