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Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review.
Polymers (Basel). 2021 Sep 29;13(19):3337. doi: 10.3390/polym13193337.
Polymers (Basel). 2021.
PMID: 34641155
Free PMC article.
Review.
Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.
Amli SFM, Salleh MAAM, Aziz MSA, Yasuda H, Nogita K, Abdullah MMAB, Nemes O, Sandu AV, Vizureanu P.
Amli SFM, et al. Among authors: aziz msa.
Materials (Basel). 2023 Jun 13;16(12):4360. doi: 10.3390/ma16124360.
Materials (Basel). 2023.
PMID: 37374543
Free PMC article.
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