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Page 1
Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends.
Micromachines (Basel). 2023 Jul 25;14(8):1491. doi: 10.3390/mi14081491.
Micromachines (Basel). 2023.
PMID: 37630026
Free PMC article.
Review.
Application of Ni/SiCw Composite Material in MEMS Microspring.
Lai L, Yu G, Wang G, Li Y, Ding G, Yang Z.
Lai L, et al.
Micromachines (Basel). 2023 Sep 14;14(9):1767. doi: 10.3390/mi14091767.
Micromachines (Basel). 2023.
PMID: 37763930
Free PMC article.
Item in Clipboard
Process improvement of high aspect ratio nano-gratings based on synchrotron x-ray.
Fan R, Wang B, Li Y, Lai L.
Fan R, et al. Among authors: lai l.
Nanotechnology. 2022 May 6;33(30). doi: 10.1088/1361-6528/ac667c.
Nanotechnology. 2022.
PMID: 35413692
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Preparation of Microneedle Array Mold Based on MEMS Lithography Technology.
Wang J, Wang H, Lai L, Li Y.
Wang J, et al. Among authors: lai l.
Micromachines (Basel). 2020 Dec 28;12(1):23. doi: 10.3390/mi12010023.
Micromachines (Basel). 2020.
PMID: 33379341
Free PMC article.
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Design, Manufacture and Test of Piezoelectric Cantilever-Beam Energy Harvesters with Hollow Structures.
Wang B, Zhang C, Lai L, Dong X, Li Y.
Wang B, et al. Among authors: lai l.
Micromachines (Basel). 2021 Sep 10;12(9):1090. doi: 10.3390/mi12091090.
Micromachines (Basel). 2021.
PMID: 34577733
Free PMC article.
Item in Clipboard
Shock-Resistibility of MEMS-Based Inertial Microswitch under Reverse Directional Ultra-High g Acceleration for IoT Applications.
Xu Q, Yang Z, Sun Y, Lai L, Jin Z, Ding G, Zhao X, Yao J, Wang J.
Xu Q, et al. Among authors: lai l.
Sci Rep. 2017 Mar 31;7:45512. doi: 10.1038/srep45512.
Sci Rep. 2017.
PMID: 28361893
Free PMC article.
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