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Year | Number of Results |
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2020 | 1 |
2021 | 2 |
2022 | 4 |
2024 | 0 |
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Page 1
Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections.
Nanomaterials (Basel). 2022 Nov 29;12(23):4241. doi: 10.3390/nano12234241.
Nanomaterials (Basel). 2022.
PMID: 36500864
Free PMC article.
Plasma-Modified PI Substrate for Highly Reliable Laser-Sintered Copper Films Using Cu2O Nanoparticles.
Cheng WH, Lee MT, Yasuda K, Song JM.
Cheng WH, et al. Among authors: yasuda k.
Nanomaterials (Basel). 2022 Sep 18;12(18):3237. doi: 10.3390/nano12183237.
Nanomaterials (Basel). 2022.
PMID: 36145025
Free PMC article.
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Optimization of Piezoresistive Strain Sensors Based on Gold Nanoparticle Deposits on PDMS Substrates for Highly Sensitive Human Pulse Sensing.
Su YS, Yang WR, Jheng WW, Kuo W, Tzeng SD, Yasuda K, Song JM.
Su YS, et al. Among authors: yasuda k.
Nanomaterials (Basel). 2022 Jul 5;12(13):2312. doi: 10.3390/nano12132312.
Nanomaterials (Basel). 2022.
PMID: 35808151
Free PMC article.
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Study on the SPCC and CFRTP Hybrid Joint Performance Produced with Additional Nylon-6 Interlayer by Ultrasonic Plastic Welding.
Wang T, Yasuda K, Nishikawa H.
Wang T, et al. Among authors: yasuda k.
Polymers (Basel). 2022 Dec 1;14(23):5235. doi: 10.3390/polym14235235.
Polymers (Basel). 2022.
PMID: 36501625
Free PMC article.
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Low-Thermal-Budget Photonic Sintering of Hybrid Pastes Containing Submicron/Nano CuO/Cu2O Particles.
Chiu PH, Cheng WH, Lee MT, Yasuda K, Song JM.
Chiu PH, et al. Among authors: yasuda k.
Nanomaterials (Basel). 2021 Jul 20;11(7):1864. doi: 10.3390/nano11071864.
Nanomaterials (Basel). 2021.
PMID: 34361253
Free PMC article.
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Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments.
Lee JH, Li PK, Hung HW, Chuang W, Schellkes E, Yasuda K, Song JM.
Lee JH, et al. Among authors: yasuda k.
Micromachines (Basel). 2021 Jun 26;12(7):750. doi: 10.3390/mi12070750.
Micromachines (Basel). 2021.
PMID: 34206756
Free PMC article.
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Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints.
Song JM, Huang BC, Tarng D, Hung CP, Yasuda K.
Song JM, et al. Among authors: yasuda k.
Nanomaterials (Basel). 2020 Jul 25;10(8):1456. doi: 10.3390/nano10081456.
Nanomaterials (Basel). 2020.
PMID: 32722382
Free PMC article.
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