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Page 1
A Review of Silver Wire Bonding Techniques.
Micromachines (Basel). 2023 Nov 20;14(11):2129. doi: 10.3390/mi14112129.
Micromachines (Basel). 2023.
PMID: 38004986
Free PMC article.
Review.
Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire.
Cao J, Zhang J, Persic J, Song K.
Cao J, et al. Among authors: persic j.
Micromachines (Basel). 2020 Aug 14;11(8):777. doi: 10.3390/mi11080777.
Micromachines (Basel). 2020.
PMID: 32824089
Free PMC article.
Item in Clipboard
Characterization of thermochemical properties of Al nanoparticle and NiO nanowire composites.
Wen JZ, Ringuette S, Bohlouli-Zanjani G, Hu A, Nguyen NH, Persic J, Petre CF, Zhou YN.
Wen JZ, et al. Among authors: persic j.
Nanoscale Res Lett. 2013 Apr 20;8(1):184. doi: 10.1186/1556-276X-8-184.
Nanoscale Res Lett. 2013.
PMID: 23601907
Free PMC article.
Item in Clipboard
Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding.
Huang Y, Shah A, Mayer M, Zhou NY, Persic J.
Huang Y, et al. Among authors: persic j.
IEEE Trans Ultrason Ferroelectr Freq Control. 2010 Jan;57(1):241-52. doi: 10.1109/TUFFC.2010.1402.
IEEE Trans Ultrason Ferroelectr Freq Control. 2010.
PMID: 20040450
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Symmetric miniaturized heating system for active microelectronic devices.
McCracken M, Mayer M, Jourard I, Moon JT, Persic J.
McCracken M, et al. Among authors: persic j.
Rev Sci Instrum. 2010 Jul;81(7):075112. doi: 10.1063/1.3469794.
Rev Sci Instrum. 2010.
PMID: 20687764
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