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Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient.
Sci Rep. 2018 Sep 17;8(1):13910. doi: 10.1038/s41598-018-32280-x.
Sci Rep. 2018.
PMID: 30224717
Free PMC article.
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu.
Juang JY, Lu CL, Li YJ, Tu KN, Chen C.
Juang JY, et al.
Materials (Basel). 2018 Nov 25;11(12):2368. doi: 10.3390/ma11122368.
Materials (Basel). 2018.
PMID: 30477274
Free PMC article.
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A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps.
Chang YW, Hu CC, Peng HY, Liang YC, Chen C, Chang TC, Zhan CJ, Juang JY.
Chang YW, et al. Among authors: juang jy.
Sci Rep. 2018 Apr 12;8(1):5935. doi: 10.1038/s41598-018-23809-1.
Sci Rep. 2018.
PMID: 29651034
Free PMC article.
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