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Page 1
Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum.
Materials (Basel). 2022 Aug 1;15(15):5301. doi: 10.3390/ma15155301.
Materials (Basel). 2022.
PMID: 35955233
Free PMC article.
Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite.
Kolenak R, Pluhar A, Drapala J, Babincova P, Pasak M.
Kolenak R, et al. Among authors: drapala j.
Materials (Basel). 2023 May 17;16(10):3795. doi: 10.3390/ma16103795.
Materials (Basel). 2023.
PMID: 37241421
Free PMC article.
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Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi-Ag-Mg-Type Solder.
Kolenak R, Melus T, Drapala J, Gogola P, Pasak M.
Kolenak R, et al. Among authors: drapala j.
Materials (Basel). 2023 Apr 10;16(8):2991. doi: 10.3390/ma16082991.
Materials (Basel). 2023.
PMID: 37109827
Free PMC article.
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Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic Composite.
Kolenak R, Kostolny I, Drapala J, Babincova P, Pasak M.
Kolenak R, et al. Among authors: drapala j.
Materials (Basel). 2021 Oct 25;14(21):6369. doi: 10.3390/ma14216369.
Materials (Basel). 2021.
PMID: 34771894
Free PMC article.
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