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jan rebound
(4,515 results)?
Study of Internal Stress in Conductive and Dielectric Thick Films.
Materials (Basel). 2022 Dec 6;15(23):8686. doi: 10.3390/ma15238686.
Materials (Basel). 2022.
PMID: 36500182
Free PMC article.
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials.
Kalaš D, Soukup R, Řeboun J, Radouchová M, Rous P, Hamáček A.
Kalaš D, et al. Among authors: reboun j.
Polymers (Basel). 2023 May 30;15(11):2526. doi: 10.3390/polym15112526.
Polymers (Basel). 2023.
PMID: 37299324
Free PMC article.
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FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers.
Kalaš D, Šíma K, Kadlec P, Polanský R, Soukup R, Řeboun J, Hamáček A.
Kalaš D, et al. Among authors: reboun j.
Polymers (Basel). 2021 Oct 27;13(21):3702. doi: 10.3390/polym13213702.
Polymers (Basel). 2021.
PMID: 34771261
Free PMC article.
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Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications.
Hlina J, Reboun J, Hamacek A.
Hlina J, et al. Among authors: reboun j.
Materials (Basel). 2021 Nov 20;14(22):7039. doi: 10.3390/ma14227039.
Materials (Basel). 2021.
PMID: 34832439
Free PMC article.
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Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper.
Hlina J, Reboun J, Simonovsky M, Syrovy T, Janda M, Hamacek A.
Hlina J, et al. Among authors: reboun j.
Materials (Basel). 2022 Feb 12;15(4):1372. doi: 10.3390/ma15041372.
Materials (Basel). 2022.
PMID: 35207913
Free PMC article.
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